Asia-Pacific Region (APAC)
300 mm wafer fab in Shanghai
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Asia-Pacific Region (APAC)
300 mm wafer fab in Shanghai
Description: 300mm wafer foundry
Location: Shanghai, Mainland China
Scope of Exyte: EPC for Basebuild
Key Features
- HLMC’s first greenfield fab
- 28nm to 14nm technology
- Total building area: 130,000m²
- Total cleanroom area: 34,000 m²
- Cleanroom classes: ISO 5 & 6 (Class 100 & 1k)
- Overall responsibility for cleanroom interior, office/lab interior, HVAC, mechanical, cleanroom air conditioning system, process exhaust system, process piping, electrical, FMCS etc.