Asia-Pacific Region (APAC)

300 mm wafer fab in Shanghai

HLMC (1)

Description: 300mm wafer foundry 
Location: Shanghai, Mainland China 
Scope of Exyte: EPC for Basebuild 

Key Features

 

  • HLMC’s first greenfield fab 
  • 28nm to 14nm technology  
  • Total building area: 130,000m²
  • Total cleanroom area: 34,000 m² 
  • Cleanroom classes: ISO 5 & 6 (Class 100 & 1k) 
  • Overall responsibility for cleanroom interior, office/lab interior, HVAC, mechanical, cleanroom air conditioning system, process exhaust system, process piping, electrical, FMCS etc.
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