Advanced Technology Facilities

Semiconductor

300 mm wafer fab
Project
Description:

300mm wafer foundry

Location:
Shanghai, China
Duration:
2017 - 2019
Scope of Exyte:
EPC for Basebuild
Key Features
  • HLMC’s first greenfield fab
  • 28nm to 14nm technology
  • Total building area: 130,000m²
  • Total cleanroom area: 34,000 m²
  • Cleanroom classes: ISO 5 & 6 (Class 100 & 1k)
  • Overall responsibility for cleanroom interior, office/lab interior, HVAC, mechanical, cleanroom air conditioning system, process exhaust system, process piping, electrical, FMCS etc.